MECHANIC MCN-UV50 Flux Paste

Overview of MECHANIC MCN-UV50 Flux Paste

MECHANIC MCN-UV50 Flux Paste is a high-quality UV50 flux designed to improve solderability and produce bright, full solder joints. Engineered for technicians and repair professionals, this flux paste delivers stable performance across BGA welding, mobile phone repair, and other digital service applications.

Key Features and Benefits

• Advanced UV50 formula for consistent wetting and easy solder flow
• Bright, full solder joints that improve electrical and mechanical connections
• Precise particle size at 25-48µm for accurate placement and reduced bridging
• High-quality solder paste material that maintains stability during storage and use
• Easy to weld which reduces rework time and improves first-pass yield

Specifications

• Type: UV50 flux paste
• Material: High-quality solder paste
• Microns: 25-48µm
• Color: As shown in the picture

Applications – Where to Use MCN-UV50 Flux Paste

• BGA welding and reballing
• Mobile phone and smartphone board repair
• Tablet and portable device repairs
• General digital service and PCB rework

How to Use

1. Clean the PCB pads and components to remove contaminants.
2. Apply the MECHANIC MCN-UV50 flux paste sparingly to pads or component leads.
3. Place solder balls or solder wire as required for the repair or rework.
4. Perform reflow or hot-air soldering following standard temperature profiles for the solder alloy in use.
5. After soldering, clean residues if necessary according to your process requirements.

Best Practices

• Use the recommended micron-size solder to match pad and stencil specifications.
• Store the paste in a cool, dry place to preserve performance.
• Test on sample boards when changing to a new flux to optimize temperature and timing.

Safety and Storage

• Keep out of reach of children.
• Avoid eye and skin contact; use gloves and eye protection when handling.
• Store in a sealed container at recommended temperatures to extend shelf life.
• Dispose of according to local regulations for chemical materials.

Why Choose MECHANIC MCN-UV50 Flux Paste

This flux paste offers a balance of precision and reliability for professional technicians. The 25-48µm particle size ensures accurate solder paste deposition while the UV50 formula promotes excellent solder joint appearance and performance. It is a practical choice for BGA, mobile phone repairs, and general electronic rework where consistent results matter.

For technicians who need dependable soldering performance and cleaner, brighter joints, MECHANIC MCN-UV50 Flux Paste delivers professional-grade results every time.