74126 Quad 3-State Bus Buffer IC (DIP)

74126 Quad 3-State Bus Buffer IC (DIP) – Product Overview

The 74126 Quad 3-State Bus Buffer IC (DIP) is a high-performance TTL logic device designed for buffering and interfacing in digital systems. It integrates four independent buffer gates with 3-state outputs, enabling controlled data flow on shared buses. Each output can be driven HIGH, LOW, or placed in a high-impedance state for safe bus sharing and multiplexing.

Key Features

• Four independent buffer channels with 3-state outputs
• Output enable control for each buffer for selective bus connection
• High-speed TTL switching performance
• Operates from a standard 5V logic supply
• Compatible with TTL and many CMOS logic levels
• Standard Dual Inline Package (DIP) for easy handling and prototyping

Benefits

• Prevents bus contention by allowing outputs to be tri-stated
• Simplifies microprocessor and memory interfacing
• Reduces loading on critical data and address lines
• Easy to use in breadboards and through-hole PCBs thanks to DIP format

Typical Applications

• Data bus interfacing and isolation
• Microprocessor and memory systems
• Address and control line driving
• Digital switching, multiplexing and demultiplexing
• Logic level buffering between subsystems

Technical Summary

• Logic family: Standard TTL
• Supply voltage: 5V typical
• Number of channels: 4 (quad)
• Output states: HIGH, LOW, High-Z (tri-state)
• Package: Dual Inline Package (DIP) for through-hole mounting

Design and Integration Tips

• Use the output enable pins to control bus access and prevent contention.
• Place decoupling capacitors near the VCC pin to stabilize the 5V supply under switching loads.
• Verify TTL/CMOS level compatibility when interfacing with non-TTL devices.
• For breadboard prototyping, confirm correct pin orientation before powering the circuit.

Package and Handling

The 74126 is supplied in a standard DIP package that is ideal for prototyping and hand soldering. The DIP form factor makes it easy to insert into breadboards and sockets for testing and development.

Ordering and Notes

When ordering, confirm the DIP package and TTL family meet your system requirements. Consult the device datasheet for detailed electrical characteristics and maximum ratings before use.

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